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Easy Release Construction Silicone Pads for Handheld Portable Electronics

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF2180-20-02ES thermal pad
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
name: Easy Release Construction Silicone Pads for Handheld Portable Electronics
Dielectric Constant: 5.0 MHz
part number: TIF2180-20-02ES
hardness: 10 Shore 00
keyword: thermal gap pad
Colour: Pink/White
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Easy Release Construction Silicone Pads for Handheld Portable Electronics

Easy Release Construction Silicone Pads for Handheld Portable Electronics


The TIF2180-20-02ES use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


TIF200-20-02ES-Series-Datasheet.pdf


Features

> Good thermal conductive: 2.0 W/mK

>Thickness: 4.5mmT

>hardness:10 shore 00

>Colour: Pink/White

>RoHS compliant
>UL recognized
>Easy release construction


Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card


Typical Properties of TIF2180-20-02ES Series
Color
Pink/White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.8 g/cm3

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

10 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
2.0W/mk
ISO22007-2.2
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

5.0 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

2.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated



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