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| Categories | Glue Dispensing Machine |
|---|---|
| Brand Name: | HSTECH |
| Model Number: | HS-VD331 |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 set |
| Price: | Negotiable |
| Payment Terms: | T/T,Western Union,MoneyGram |
| Supply Ability: | 50 sets per month |
| Delivery Time: | 15~20 work days |
| Packaging Details: | Wooden package |
| Product Name: | Visual Glue Dispensing Machine |
| Axis: | 3 Axis |
| Working Range: | 400mm*300mm*2 |
| Speed: | Max 1000mm/s |
| Condition: | New |
| Warranty: | 1 Year |
| Company Info. |
| Shenzhen Hansome Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Stepper motor Visual Glue Dispensing Machine Timing Blet for X Y Z Axis Screw
Introduction
A glue dispenser, also known as a glue coater or glue potting
machine, is an automated device that uses air pressure, a pump, a
screw, or other power sources to squeeze fluids such as glue,
solder paste, grease, and epoxy from a container and precisely
apply them to a workpiece surface along a predetermined path and
dosage.
Core Value: Achieve precise, efficient, and consistent fluid application, replacing unreliable manual operations.
| Model | HS-VD331 |
|---|---|
| Voltage | AC110V/220V,50/60Hz,Meanwell brand |
| Air pressure | 0.5-0.7Mpa |
| Light source | LED source |
| X/Y/Z working range | 400mm*300mm*2 |
| XYZ speed | 1000mm/s |
| Y platform | 190*150mm |
| Repeat accuracy | 0.02mm |
| Gule viscosity range | max≤5000LPS |
| Motor | Stepper motor |
| Driven system | Timing blet for X/Y, Z axis screw |
| Document support | CAD,CorelDRAW |
| Loading capacity | X/Y:10kg,Z:5kg |
| Linear Guide | CSK(Taiwan brand) |
| Photoelectric switch | (Germany brand) |
| Operation system | Windows |
| Gross weight | 600kg |
Main Application Areas
1. Electronics and Semiconductors
Chip Packaging: Underfill, encapsulation, and die bonding.
PCB: Conformal coating, thermal paste/silicone grease application, SMT red glue, and component mounting.
Acoustic Devices: Speaker dispensing for sealing and damping.
2. Automotive Electronics
ECU Control Units: Potting and protection.
Sensors: Sealing and protection.
Automotive Lighting: LED driver module potting, light bonding and sealing.
3. Medical Devices
Disposable Consumables: Dispensing and sealing sensors and microfluidic chips.
Device Assembly: Bonding and sealing precision instruments, requiring extremely high cleanliness and consistency.
4. Photovoltaics and Energy Storage
PV Inverters: Potting and protection.
Battery Packs: Bonding and thermal conductivity between battery cells and busbars.
5. Consumer Product Manufacturing
Smartphones/Wearables: Structural bonding, component mounting, and waterproof sealing.
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