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1.0mmt Silicone Thermal Gap Pad For Heat Pipe Thermal Solutions

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF140-40-11US
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
hardness: 20 shore 00
Thermal conductivity: 4.0 W/m-K
Colour: gray
Certifications: UL
keyword: thermal gap pad
name: 1.0mmt Silicone Thermal Gap Pad For Heat Pipe Thermal Solutions
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1.0mmt Silicone Thermal Gap Pad For Heat Pipe Thermal Solutions

Moldability for complex parts 1.0mmT silicone pads for Heat pipe thermal solutions


The TIF140-40-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


TIF100-40-11US-Series-Datasheet.pdf


Features

> Good thermal conductive: 4.0 W/mK

>Thickness:1.0mmT

>hardness:20 shore 00

>Colour: Gray

>Moldability for complex parts

>Outstanding thermal performance

>High tack surface reduces contact resistance


Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices


Typical Properties of TIF140-40-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Denisty

3.15g/cm3
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.40%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
6.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
4.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Standard Sheets Sizes:

8" x 16"(203mm x 406mm)


TIF™ series Individual die cut shapes can be supplied.



FAQ:

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Quality 1.0mmt Silicone Thermal Gap Pad For Heat Pipe Thermal Solutions for sale
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