SAK-TC223S-16F133F AC IC MCU 32BIT 1MB FLASH 100TQFP

SAK-TC223S-16F133F AC

Products Description:

Modern mobile devices require a charger that provides faster charging but comes in a small size. High power density and cost-effective power supplies can be designed by operating the converter at a higher switching frequency to avoid a considerable increase in the transformer and the output capacitor size. In achieving the required thermal performance and EMI behavior, power devices with lower losses and controlled switching behavior enable effective and fast product development. To address these requirements, Infineon offers its CoolMOS™ P7 SJ MOSFET family for adapters and chargers. Special care has been taken to ensure very good thermal behavior, increased efficiency, meeting all EMI requirements and ease of design. In addition, power devices in IPAK/SMD packages enable optimal PCB layout through minimal footprint. SMD packages offer additional benefits for automatized large volume production. Specifically, Infineon’s SOT-223 cost-effective package enables high power density at low manufacturing cost allowing SMT manufacturing to maintain very good thermal performances. Infineon’s state-of-the-art XDP™ digital-based controllers enable the forced-frequency-resonant flyback, forced-quasi-resonant flyback, as well as hybrid flyback with zero-voltage-switching (ZVS) operation, ideal for high-power-density adapters and well support USB-PD (power delivery) requirements. In addition, the digital soft-switching controller, CoolMOS™ high-voltage MOSFETs, OptiMOS™ low-voltage MOSFETs and synchronous rectification IC and broad EZ-PD™ protocol controller portfolios enable high power density designs possible whilst meeting the thermal requirements. The EZ-PD™ CCG3PA-NFET is a highly integrated USB-C PD port controller for power adapters. It integrates NFET gate driver for VBUS and is compatible with the latest USB-C Power Delivery standard. In addition CCG3PA-NFET also supports legacy protocols including QC4.0, Apple 2.4 A charging, Samsung AFC and BC1.2 with no additional BOM.

Technological Parameters:

Customer Service:

1. Do you support BOM lists?

Of course, we have a professional team to provide BOM.

2. Shown below. Behind MOQ?

Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.

3. What about lead time?

After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.

4. Our advantage?

1. Stable and sufficient supply

2. Competitive pricing

3. Rich BOM experience

4. Perfect after-sales service

5. Professional test certificate

5. Our service?

Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...

6. Transportation:

DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping

Product Photos:

Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc.

We have established stable business relationships with product developers such as SAMSUNG, MICRON, ALTERA, NXP, ATMEL, INFINEON, AOS, TOSHIBA, HYNIX, TI, NS, ST, ADI, VISHAY, MAXIM, ON, KEC, ROHM, WINBONOD, as well as European and American component developers, and enjoy franchise distribution rights for multiple company components. The company keeps a large amount of inventory year-round and provides professional ordering services to customers.

Since its establishment, Dingcen International (Hong Kong) Co., Ltd. has provided electronic components through cooperation with the original factory and top agents, ensuring that all sold components are original and genuine, with 100% guaranteed quality