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| Categories | EMS PCB Assembly | 
|---|---|
| Brand Name: | IBE | 
| Model Number: | IBE-02 | 
| Certification: | ISO14001 | 
| Place of Origin: | CHINA,VIETNAM,USA | 
| MOQ: | NO MOQ | 
| Price: | Negotiable | 
| Payment Terms: | L/C, T/T | 
| Delivery Time: | 15 WORKING DAYS | 
| Packaging Details: | BAG | 
| Colour: | Blue | 
| Name: | PCB assembly | 
| Layer: | 2 | 
| Material: | Aluminum | 
| Max panel size: | 730mm*608mm | 
| Surface: | HASL | 
| Company Info. | 
| IBE ELectronics Co.,LTD | 
| View Contact Details | 
| Product List | 
Quick Delivery EMS PCB Assembly Service in Shenzhen,China
IBE is a professional PCB,SMT,PCB assembly, components sourcing and box build provider for global electronics manufacturing services(EMS).
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.
We have a proven record of guiding manufacturers throughout the entire electronics manufacturing process. From simple designs to complex system integration, IBE provides the end-to-end electronics manufacturing services necessary to compete in a global marketplace.
Production capability:
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers | 
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm | 
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating | 
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm | 
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers | 
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm | 
| 7 | PCBA QC | X-ray,AOI Test,Functional Test | 
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc | 
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control | 



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