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| Categories | E Cigarette PCB Board |
|---|---|
| Brand Name: | TOPCBS |
| Model Number: | Electronic cigarette mainboard |
| Certification: | UL94V0 |
| Place of Origin: | Suzhou China |
| MOQ: | Negotiation |
| Price: | Negotiation |
| Payment Terms: | T/T |
| Supply Ability: | 10000unit per month |
| Delivery Time: | 10-14working days |
| Packaging Details: | 20units per package box size 20*15*10cm |
| Layer: | 4Layer (1+2Flex+1) |
| Material: | DS-600D |
| Finished treatment: | Immersion gold |
| Board color: | Rigid area Green, Flex area Yellow |
| Board thickness: | 0.34mm |
| Line width/space: | 80um/100um |
| Laser drill size: | 75um |
| Soldermask: | Green |
4Layer Rigid-flex PCB for Electronic cigarette mainboard
PCBA services include:
1. Automated and manual fine pitch SMT
2. BGA with X-RAY and rework capability
3. Lead-free assembly
4. Wave soldering
5. In circuit testing
6. Function testing
7. Conformal coating
8. Burn in
9. AOI inspection systerm
10. X-RAY inspection
Rigid-flex PCB can be used in consumer electronics, and meet 3D assembly requirement of products with specific flexible bending area design, .
Specifications:
| Name | 4Layer Rigid-flex PCB for Electronic cigarette mainboard |
| Layers | 4 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | DS-600D |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
| Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| Line width space | 2.36/2.36mil | 2.0/2.0mil | Nath Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test:16000 | NA |
| Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
| Minimum semi-metalized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°,30°,45° | NA |
| Max production board size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| Max Aspect ratio | 8:01 | 10:01 | Min. Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
| line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
| Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
|
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