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Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device

Categories Heat Sink
Brand Name: JBNR
Model Number: CPC141,CPC232,CPC300
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: copper/moly copper/copper
Density: 9.2
CTE: 9.5
TC: 260
Application: RF Power Device Package
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Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device


Cu / Mo70Cu / Cu (CPC) Heat Sinks and Shims For High Power Device


Description:

Cu/Mo70Cu/Cu is a sandwich composite similar to that of Cu/Mo/Cu with a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1: 4: 1. It has different CTE in X and Y direction, with higher thermal conductivity than that of W(Mo)Cu &Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism

Product Properties:
GradeDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC1419.57.3

280(XY)/170(Z)

CPC2329.310.2255(XY)/250(Z)

Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.


Product picture:

Quality Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device for sale
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