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| Categories | Ceramic Electronic Components |
|---|---|
| Brand Name: | CMC |
| Model Number: | TMC-08 |
| Certification: | ISO9001, IATF16949, ISO14001, ISO45001, RoHS |
| Place of Origin: | China |
| MOQ: | 2000pcs |
| Price: | USD0.2-0.5 |
| Supply Ability: | 100,000/month |
| Delivery Time: | 25 work day |
| Packaging Details: | carton |
| color: | as per customer |
| Company Info. |
| Hunan Meicheng Ceramic Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Steatite Ceramic for Electric Appliance, Porcelain Electric Heater, Thermostat and Insulator
1.Descriptions:
Magnetron series ceramics are produced by using high-purity composite alumina combined with dry-pressing method, which are widely used in electrical protection products.
2. Key Words:
Ceramics are with uniform texture and good batch stability,Outstanding arc extinguish competency,Ceramics are with high flexural strength, high tensile strength and good air tightness,dry-processing,white, pink or customized,95% alumina or steatite,Micro Oven & industrial Microwave Products,generator.
3. Parameters:
| 产品参数 Parameters: | |||
| 物理性能 Physical Property | 材质 Material | 95 氧化铝 | 95% Alumina |
| 生产工艺 Production Process | 干压成型 | Dry Pressing | |
| 产品尺寸 Product Dimension | 按客户图纸 | Per customers' drawing | |
| 体积密度 Density (g/cm3) | 3.70-3.75克/立方厘米 | 3.70-3.75g/cm3 | |
| 吸水率 Water Absorption | 0% | 0% | |
| 机械性能 Mechanical Performance | 弯曲强度 Flexural Strength (Mpa) | 310兆帕 | 310Mpa |
| 弹性模量 Young'Modulus of Elasticity (Gpa) | 310吉帕 | 310Gpa | |
| 硬度 Hardness (Gpa) | 12.9吉帕 | 12.9Gpa | |
| 泊松比 Poisson Ratio | 0.23 | 0.23 | |
| 热性能 Thermal Character | 线膨胀系数 Linear Expansion Coefficient | 7.2 | 7.2 |
| 热导率 Heat Conductivity (W/mk) | 23 | 23 | |
| 电性能 Electrical Property | 介电常数 Dielectric Constant | 9.2 | 9.2 |
| 介质损耗角正切 Dielectric Loss Tangent (x10-4) | 8 | 8 | |
| 绝缘强度 Insulation Strength (x106V/M) | 15 | 15 | |
| 金属化陶瓷性能 Metalized Ceramic Performance | 气密性 Air Tightness (Pa·m3/s) | ≤10-8 | ≤10-8 |
| 体积电阻率 Bulk Resistivity (Ω·cm) | ≥1010 (20°C), ≥106 (300°C) | ≥1010 (20°C), ≥106 (300°C) | |
| 结合强度 Bonding Strength (Mpa) | N/A | N/A | |
| 金属层厚度 Metallization Thickness (μm) | N/A | N/A | |


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