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| Categories | Lead Free PCB Assembly |
|---|---|
| Brand Name: | HNL-PCBA |
| Model Number: | PCB Assembly 04 |
| Certification: | ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000 |
| Place of Origin: | CHINA |
| MOQ: | 1 PC |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, L/C, MoneyGram |
| Supply Ability: | 10,000,000 Point /Day |
| Delivery Time: | 1-7days |
| Packaging Details: | ESD packaging with carton box |
| Product name: | Lead-Free PCB Assembly |
| Base Material: | FR-4, HASL |
| Copper thickness: | 6OZ |
| Min. line width: | 0.030mm/0.030mm |
| Board thickness: | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| Min. hole size: | Laser 0.05mm ; Mechnical 0.15 |
| Surface finishing: | HASL, ENIG, OSP, Lead free HASL, HASL/OSP/ENIG |
| PCB Assembly method: | SMT, DIP, THT;Mixed; Customized |
| Layer: | 1~48 Layers; as require |
| Service: | One-stop Service,PCB & PCBA,ODM and OEM |
Components used in lead-free PCB assembly should meet the requirements of lead-free compliance, also ensure the reliability and suitability of final products. With more than 15 years' experience in this field, we has maintained such long-term and friendly cooperation relationship between renowned component manufacturers and distributors around the world, we can purchase high quality lead-free components for our customers and care the environmental concerns. If you still have problem with lead free, please feel free to contact us.
PCBA CAPABILITIES
| FACTORY CAPABILITIES | |||
| No. | Items | 2020 | |
| 1 | HDI Capabilities | HDI ELIC(5+2+5) | |
| 2 | Max layer count | 46L | |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | |
| 4 | Min.Hole Size | Laser 0.05mm | |
| Mechnical 0.15 | |||
| 5 | Min Line Width/Space | 0.030mm/0.030mm | |
| 6 | Copper Thickness | 1/3oz-6oz | |
| 7 | Size Max Panel size | 700x610mm | |
| 8 | Registration Accuracy | +/-0.05mm | |
| 9 | Routing Accuracy | +/-0.05mm | |
| 10 | Min.BGA PAD | 0.125mm | |
| 11 | Max Aspect Ratio | 10:01 | |
| 12 | Bow and Twist | 0.50% | |
| 13 | Impedance Control Tolerance | +/-5% | |
| 14 | Daily output | 4,000m2 (Max capacity of equipment) | |
| 15 | Surface Finishing | HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT--Wave Soldering---Assembling---ICT--Function Testing---Temperature & Humidity Testing



| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Printed circuit boards And PCB Assembly are mainly used for many communication industry ,Aprospace ,Auto Industry ,Communication,Indutrial Control ,Medical device ,Smart Home,consumer electronics ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, printer ,Auto Industry ,Smart Home.etc.

Workshop



Common packaging
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box


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