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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF045-11 |
| Certification: | UL and RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 10000/day |
| Delivery Time: | 7-15work days |
| Packaging Details: | 600cc/tube |
| Product name: | Factory Hot Sale Thermal Conductive Gel Super High Thermal Conductivity Thermal Conductive Gel 4.5W Silica Gel |
| Specific Gravity: | 3.2g/cc |
| Color: | Gray |
| Recommended operating Temp: | -45-200 ℃ |
| Good thermal conductive: | 4.5 W/mK |
| Keywords: | Thermal Conductivity gel |
| Shelf Life: | 12 months |
| Flame Rating: | UL 94 V-0 |
| Bond Line thickness: | 0.20mm |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Factory Hot Sale Thermal Conductive Gel Super High Thermal Conductivity Thermal Conductive Gel 4.5W Silica Gel
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Products Description
TIF045-11 is a soft silicone gel-based gap filler pad,formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF045-11 has a higher viscosity, which effectively prevents filer separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting. and other high-power electronic components.
Feature
>Thermal conductivity: 4.5 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability
Application
>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment
| TIF®045-11 Typical Properties | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 40 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 3.20g/c | ASTM D297 |
| Thermal conductivity | 4.5W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.077 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.068 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.2 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Product Specification
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
Custom packaging available for automation use. Please contact us
for confirming.
If you want to know our thermal products, please visit our website.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
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