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| Categories | Integrated Circuit Switch | 
|---|---|
| Brand Name: | Micro chip | 
| Model Number: | SST26VF032BT-1041/SM | 
| Certification: | Original Part | 
| Place of Origin: | Shenzhen, China | 
| MOQ: | 1PCS | 
| Price: | to be Negotiated | 
| Payment Terms: | T/T, Western Union, Paypal, Wechat Pay | 
| Supply Ability: | 1 Million pieces per Month | 
| Delivery Time: | Immediate | 
| Packaging Details: | 8SOIJ | 
| Packaging: | 8SOIJ | 
| Product Description: | IC FLASH 32M SPI 104MHZ 8SOIJ | 
| Product Type: | Flash Serial 3V 32Mbit 32M x 1Bit 8-Pin SOIJ T/R - Product that comes on tape, but is not reeled | 
| Operating Temp Range: | -40C to 85C | 
Electronic Components NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 8-Pin SOIJ T/R SST26VF032BT-1041/SM Integrated Circuits
Description :
The Serial Quad I/O™ (SQI™) family of flash-memory devices features a six-wire, 4-bit I/O interface that allows for low-power, high-performance operation in a low pin-count package. SST26VF032B/032BA also support full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol. System designs using SQI flash devices occupy less board space and ultimately lower system costs.
All members of the 26 Series, SQI family are manufactured with proprietary, high-performance CMOS SuperFlash® technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
SST26VF032B/032BA significantly improve performance and reliability, while lowering power consumption. These devices write (Program or Erase) with a single power supply of 2.3-3.6V. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology usesless current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash memory technologies.
SST26VF032B/032BA are offered in 8-contact WDFN (6 mm x 5 mm), 8-lead SOIJ (5.28 mm), and 24-ball TBGA (6mm x 8mm).
Features :
• Single Voltage Read and Write Operations
- 2.7-3.6V or 2.3-3.6V
• Serial Interface Architecture
- Nibble-wide multiplexed I/O’s with SPI-like serial command structure
- Mode 0 and Mode 3
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol
• High Speed Clock Frequency
- 2.7-3.6V: 104 MHz max
- 2.3-3.6V: 80 MHz max
• Burst Modes
- Continuous linear burst
- 8/16/32/64 Byte linear burst with wrap-around
Technical Specifications :
| Mounting | Surface Mount | 
| Lead Shape | Gull-wing | 
| Package Length | 5.26 | 
| Package Width | 5.25 | 
| Package Height | 1.98(Max) | 
| PCB changed | 8 | 
| Cell Type | NOR | 
| Chip Density (bit) | 32M | 
| Architecture | Sectored | 
| Boot Block | Yes | 
| Block Organization | Symmetrical | 
| Location of Boot Block | Bottom|Top | 
| Address Bus Width (bit) | 32 | 
| Sector Size | 4Kbyte x 1024 | 
| Page Size | 256byte | 
| Programmability | Yes | 
| Timing Type | Synchronous | 
| Maximum Erase Time (s) | 0.05/Chip | 
| Maximum Programming Time (ms) | 1.5/Page | 
| Process Technology | CMOS | 
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) | 
| Minimum Operating Supply Voltage (V) | 2.3 | 
| Typical Operating Supply Voltage (V) | 3.3|3 | 
| Maximum Operating Supply Voltage (V) | 3.6 | 
| Programming Voltage (V) | 2.7 to 3.6 | 
| Operating Current (mA) | 20 | 
| Program Current (mA) | 25 | 
| Minimum Operating Temperature (°C) | -40 | 
| Maximum Operating Temperature (°C) | 85 | 
| Supplier Temperature Grade | Industrial | 
| Command Compatible | No | 
| ECC Support | No | 
| Support of Page Mode | No | 
| Minimum Endurance (Cycles) | 100000 | 
| Packaging | Tape and Reel | 
| Standard Package Name | SOP | 
| Supplier Package | SOIJ | 
| Pin Count | 8 | 
for product datasheet, CONTACT US directly.
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