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| Categories | Half Hole PCB |
|---|---|
| Brand Name: | WITGAIN PCB |
| Model Number: | S04E3691A0 |
| Certification: | UL Certificate |
| Place of Origin: | China |
| MOQ: | negotiable |
| Price: | negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 1kkpcs/month |
| Delivery Time: | 20 work days |
| Packaging Details: | 320pcs/bag , 20bags/carton |
| PCB Type: | HDI and Half Hole |
| Layer Count: | 4 Layer |
| Blind Hole: | L1-L2, L3-L4 0.1MM |
| Buried Hole: | L2-L3 0.2MM |
| Finished Thickness: | 0.8MM |
| Material: | FR4 |
| Company Info. |
| Witgain Technology Ltd |
| View Contact Details |
| Product List |
4 Layer Half Hole Printed Circuit Board , Finished Thickness 0.8MM , HDI , Blind And Buried Holes
4 Layer Half Hole Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 0.8MM
Copper Thickness: 1/H/H/1OZ
BGA Size: 10 Mil, Via In Pad
Min Hole: 0.1MM
Min Line: 3/3 Mil
Hole: L1-L4
Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM
Buried Hole: L3-L4 0.2MM
Solder Mask: Green
Surface Treatment: ENIG
Material: FR4
Unit Size: 84*92MM/4*4up
Special Treatment: 4 Side Half Plated Holes
Application: WIFI Module
Capabilities:
| Item | Capability |
| Layer Count | 1-24 Layers |
| Board Thickness | 0.1mm-6.0mm |
| Finished Board Max Size | 700mm* 800mm |
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| Warp | <0.7% |
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter | 0.1mm-6.5mm |
| Out Layer Copper Thickness | 1/20Z-8OZ ; |
| Inner Layer Copper Thickness | 1/3OZ-6OZ |
| Aspect Ratio | 10:1 |
| PTH Hole Tolerance | +/-3mil |
| NPTH Hole Tolerance | +/-1mil |
| Copper Thickness Of PTH Wall | >10mil(25um) |
| Line Width And Space | 2/2mil |
| Min Solder Mask Bridge | 2.5mil |
| Solder Mask Alignment Tolerance | +/-2mil |
| Dimension Tolerance | +/-4mil |
| Max Gold Thickness | 200u'(0.2mil) |
| Thermal Shock | 288C, 10s, 3 Times |
| Impedance Contro | +/-10% |
| LTest Capability | PAD Size Min 0.1mm |
| Min BGA | 7mil |
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
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