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| Categories | Turnkey PCB Assembly | 
|---|---|
| Brand Name: | FASTPCBA | 
| Model Number: | PCBA Manufacturers | 
| Certification: | IATF16949, ISO13485, ISO9001 | 
| Place of Origin: | China | 
| MOQ: | 1pcs | 
| Price: | 0.5-30USD | 
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram | 
| Supply Ability: | 150000 Pieces per Month | 
| Delivery Time: | 1-10 work days | 
| Packaging Details: | PCB: Vacuum Packing/ PCBA: ESD Packing | 
| Name: | PCBA Manufacturers | 
| Laminate materials: | FR4, High TG FR4, High Frequency, Alum, FPC | 
| Number of layers: | 1-48 | 
| Board Thickness: | Single/Double:0.008±0.004” | 
| package: | QFN,BGA,SSOP,PLCC,LGA | 
| MOQ: | NO MOQ (1pcs) | 
| Company Info. | 
| FASTPCBA Co., Ltd. | 
| View Contact Details | 
| Product List | 
PCB Techinecal Capacity
| Layers | Mass production: 1~48 layers | 
| Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm | 
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. | 
| Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) | 
| Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ | 
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) | 
| Max. Panel Size | 1150mm × 560mm | 
| Aspect Ratio | 18:1 | 
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | 
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. | 
PCBA technical Capacity
| SMT | Position accuracy:20 um | 
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm | 
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep | 
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN | 
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling | 



Use cases:
Automotive
Comsumer Electronics
Smart Home
Industrial Automation
Medical Devices
Telecommunication Electronics
New Energy
And so on

Our complete factory production system and strict quality requirements have helped hundreds of customers finished successful projects.
JINGBANG has a dedicated team of professionals to guide you at every step - from sourcing to overcoming any potential challenges along the way.
The most important is the reliable material procurement channel would help you to minimize BOM costs.

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