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1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF1100-02F Series
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: 1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules
Construction & Compostion: Ceramic filled silicone elastomer
Density: 2.3 g/cc
Hardness: 60 Shore 00
Continuous Use temp(℃): -40~160℃
Thermal conductivity: 1.5W/m-K
Keywords: Silicone Thermal Pad
Color: Gray
Application: Laptop/Desktop/GPU/Computer/Memory Modules
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  • Product Details
  • Company Profile

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products description


The TIF®1100-02F Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features


>Good thermal conductivity: 1.5W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness

>High tack surface reduces contact resistance
>RoHS compliant
>UL recognized


Application


>Cooling components to the chassis of frame
>Set Top Box
>Car Battery & Power Supply
>Charging Pile
>LED TV/Lighting
>Graphics Card Thermal Module

>CPU
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules


Typical Properties of TIF®1100-02F Series
ColorGrayVisual
ConstructionCeramic filled silicone elastomer******
Thickness Range(inch/mm)0.020~0.20inch(0.5mm~5.0mm) ASTM D374
Density(g/cc)2.3 g/ccASTM D297
Hardness60 Shore 00ASTM 2240
Recommended Operating Temperature(℃)-40 to 160℃******
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant @ 1MHz4.0ASTM D150
Volume Resistivity≥1.0X1012Ohm-meterASTM D257
Flame rating94 V-0UL E331100
Thermal conductivity1.5W/m-KASTM D5470

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract


Quality 1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules  for sale
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