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| Categories | SMT Mounting Machine |
|---|---|
| Brand Name: | eton |
| Model Number: | ht-e8s |
| Certification: | ccc,ce,sira |
| Place of Origin: | china |
| MOQ: | 1 unit |
| Price: | $43000/unit |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 80 units per months |
| Delivery Time: | 30 work days |
| Packaging Details: | Waterproof material packing and wooden case |
| pcb size: | 100*100mm~1200*350mm |
| pcb clamp;ing: | adjustable pressure pneumatic |
| system: | windows7 |
| software: | r&d independently |
| display: | touch screen monitor |
| input device: | keyboard,mouse |
| no. of camera: | 2 |
| POWER: | 380AC 50HZ |
| power consmption: | 4kw |
| mounting mode: | Group take cent stick, cent take cent stick. |
| components space: | 0.2mm |
| feeders stations: | 30PCS |
| nozzles: | 8PCS |
| mounting speed: | 40000CPH |
| mounting height: | 40mm |
product details
HT-E8S machine is single module multifunctional mounter with high capacity of 40000CPH. It can mount capacitors,resistors,LED3014/3020/3528/5050,IC and shaped components. It applies to power driver,electric board,lens,linear bulb,household appliance and etc.
product Technical parameters of high speed pick and place machine
Business terms of smt mounter
| Accepted delivery terms | EXW, FOB, CIF, CFR |
| Accepted payment currency | USD,CNY |
| Accepted payment type | L/C, T/T |
| Nearest port | Shenzhen |
Packing & delivery of smt mounter machine
Packing details: vacuum packing and wooden case
Shipping: Shenzhen port within 30 days after payment
Port: Shenzhen
Lead time:
| Quantity (units) | Est. Time (days) |
| １－２ | >２ |
| 3０ | To be negotiated |
Production line example of [pick and place machine
Company profile
our clients
contact
Name:Brynn
Email :Brynn@eton-mounter.com
WeChat:13802252825
Telephone:138 0225 2825
Industry related knowledge
Reflow soldering
Background to technology generation:
Because of the need of continuous miniaturization of electronic products PCB boards, flake components appear, and traditional welding methods can no longer meet the needs. At first, only the reflow welding process was used in the assembly of mixed integrated circuit boards. Most of the components were sheet capacitance, sheet inductance, mount transistor and diode. With the development of SMT whole technology and the emergence of various patch components (SMC) and mount devices (SMD), the reflow welding technology and equipment as part of mount technology have been developed accordingly.
Factors affecting the welding process:
During the SMT reflow welding process, the main reasons for the uneven heating of components are: the difference of heat capacity or heat absorption of reflow welding elements, the influence of conveyor belt or heater edge, and the load of reflow welding products.
1. PLCC,QFP usually have a larger heat capacity than a discrete piece, it is more difficult to weld large-area components than small ones.
2. the conveyor belt in the reflow welding furnace makes the transfer product reflow welding at the same time, it also becomes a heat dissipation system. in addition, the edge of the heating part is different from the central heat dissipation condition, the edge temperature is generally low, and the temperature of the same carrier surface is also different in the furnace except for the different temperature requirements of each temperature zone.
3. the impact of different product loading. The temperature curve of reflow welding should be adjusted with good repeatability under no load, load and different load factors. the load factor is defined as: LF=L/(LLF=L/S); where LLLF=L/S the length of the assembled substrate, SLLF=L/S the interval between the assembled substrates.
The larger the load factor, the more difficult the reflow welding process is. Generally, the range of the maximum load factor of the reflow welding furnace is 0.5~0.9. This depends on the product situation (component welding density, different substrate) and different models of reflow furnace. To get good welding effect and repeatability, practical experience is important.
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