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Flexible Printed Circuit FPC on PET with White Solder Mask

Categories Flexible PCB Board
Brand Name: Bicheng
Model Number: BIC-257.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: PET
Layer count: 2 layers
PCB thickness: 0.15mm
PCB size: 172 x 145mm=1PCS
Coverlay: White
Silkscreen: NO
Copper weight: 35um
Surface finish: Immersion gold
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Flexible Printed Circuit FPC on PET with White Solder Mask

Flexible Printed Circuit FPC on PET with White Solder Mask

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


General Information

This is a type of dual layer flexible circuit built on PET substrate, 1oz copper weight on each layer. The FPC is coating with white solder mask and immersion gold on pads. The pads are bulged for the printer applications.


FPC Specifications

PCB SIZE172 x 145mm=1PCS
Base Material:PET
Number of LayersDouble sided PCB
SMTn/a
Through Hole Componentsno
LAYER STACKUPCopper ------- 35um(1oz)
Adhesive
PET
Adhesive
Copper ------- 35um(1oz)
Minimum Trace and Space:4mil/8mil
Minimum / Maximum Holes:1.2mm/ 3.5mm
Final foil external:1oz
Final foil internal:0oz
Final height of PCB:0.25mm ±0.05
Surface FinishImmersion gold
Solder Mask Apply To:TOP, Bottom
Solder Mask Color:White Coverlay
CONTOUR/CUTTINGPunching
Stiffener:PET on back of gold finger area
Side of Component LegendNO
Colour of Component LegendNO
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Features and Benefits

Excellent flexibility;

Reduced PCB volume;

Reduced weight;

Increased reliability

Consistency of assembly;

More than 18+ years of PCB experience;

Customer complaint rate: <1%

Prototype capability;

Volume Production capability


Typical Applications

Capacitive touch screen / panel, Industrial control temperature controller soft board, consumer card reader soft board


Covercoat / Solder Mask

Solder mask in flexible PCB is different from rigid board, it is usually a polyimide film coated on one side with a semi-cured and non-tacky adhesive, we call it covercoat in flexible circuit. It is laminated to the flexible circuit under heat and pressure, so that the copper pattern is fully encapsulated except for the solder pads that are exposed through access holes in the covercoat.


The covercoat production sheet should be cut slightly smaller than the flexible circuit production sheet to avoid premature edge sealing, which could trap air bubbles in the package.


The production sheet for the covercoat is provided with tooling holes in close register with the tooling holes in the production sheet for the flexible circuit. The access holes are usually drilled, but in the case of high-volume production, punching is more cost-effective.


In principle, drilling of the covercoat is accomplished in the same way as when drilling rigid boards, i.e., a number of covercoat sheets are stacked, either 5-up or 10-up. The drilling parameters, however, are somewhat different, because of the polyimide material and the absence of copper foil, which otherwise could have removed some of the heat from the holes being drilled.


When drilling/punching large covercoat production sheets, it is necessary to compensate for the dimensional changes of the flexible circuit production sheet, which can amount to as much as 0.2%.


FPC Capabilities 2022

No.SpecificationsCapabilities
1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall≧ 8 um
12Minimum Track/Gap of Single Layer Board0.025/0.03mm
13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend≧ 0.125mm
16Minimum Heigh of Silk Legend≧0.75mm
17Distance from Legend to Pad≧0.15mm
18Distance from Opening Solder Mask of Drill Coverlay to Track≧0.03mm
19Distance from Opening Solder Mask of Punching Coverlay to Track≧0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
26Mininum Radius of Bevel Angle (Outline)0.2mm
27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

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