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Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Categories Thermal Conductive Gel
Brand Name: Ziitek
Model Number: TIF050-11
Certification: UL
Place of Origin: China
MOQ: 1000tube
Price: 0.1-100USD/KG
Payment Terms: T/T
Supply Ability: 10000KG/MONTH
Delivery Time: 3-8 WORK DAYS
Packaging Details: 300cc/tube
Products name: Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Shape: putty
Application: Semiconductor Automatic Laboratory Equipment
Color: Gray
made by: Ceramic filled silicon material
Keyword: Thermal gel
Recommended Operating Temp: -45-200 ℃
Density(g/cc): 3.20
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  • Company Profile

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocesors, PPGAs, micro

BGA packages, BGA packages, DSP chips, circular silicon chips,LED lighting, and other high-power electronic components.


Feature

>Thermal conductivity: 5.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically

>Proven long-term reliability


Application

>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment


TIF®050-11 Typical Properties
PropertyValueTest method
ColorGrayVisual
Construction & CompositionCeramic filled silicon material-
Flow Rate(g/min)40Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)3.20g/cASTM D297
Thermal conductivity5.0W/mKASTM D5470
Thermal Impedance @10psi (℃.in²w)0.077ASTM D5470
Thermal Impedance @50psi (℃.in²w)0.068ASTM D5470
Recommended Operating Temp-45 ~200°CZiitek Test Method
Dielectric Strength(V/mm)≥4000ASTM D149
Bond Line Thickness(mm)0.20Ziitek Test Mothod
Flame RatingV-0UL 94
Shelf Life12 months-
Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.


Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


FAQ:


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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