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| Categories | Multilayer PCB Board | 
|---|---|
| Brand Name: | OEM ODM | 
| Model Number: | SL81104S23 | 
| Certification: | UL, Rohs | 
| Place of Origin: | China | 
| MOQ: | No MOQ | 
| Price: | Negotiation | 
| Payment Terms: | T/T, Western Union, MoneyGram,Paypal | 
| Supply Ability: | 30000pcs per day | 
| Delivery Time: | 5-7 days | 
| Packaging Details: | ESD Bag | 
| Surface Finishing: | ENIG+OSP | 
| Class Standard: | IPC-6012 Class -II | 
| NPTH Tolerance: | +/-0.05mm | 
| Features 1: | Gerber/PCB File Needed | 
| Features 2: | 100% E-test | 
| Features 3: | Quality 2 Years Guarantee | 
High density interconncection Multilayer PCB Board Supplier in China
Multilayer PCB board
Production line process
Blank PCB
Material Cutting→Drilling→PTH→Photo process→Circuit
Exposure→Etching→Touch up→Pannel plating→Plug hole→Print Solder
mask ink→Surface Finish→Profile→Punch/V-cut→E-testing→→Final Visual
Inspection→Packing
PCB Capacity
| PCB General Capability | |
| Number of Layer | 1 - 18 Layer | 
| Maximum Processing Area | 680 × 1000MM | 
| Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) | 
| 4 Layer - 0.4MM ( 16 mil ) | |
| 6 Layer - 0.8MM ( 32 mil ) | |
| 8 Layer - 1.0MM ( 40 mil) | |
| 10 Layer - 1.1MM ( 44 mil ) | |
| 12 Layer - 1.3MM ( 52 mil ) | |
| 14 Layer - 1.5MM ( 59 mil ) | |
| 16 Layer - 1.6MM ( 63 mil ) | |
| 18 Layer - 1.8MM ( 71 mil ) | |
| Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM | 
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | |
| Twisting and Bending | ≤ 0.75%, Min: 0.5% | 
| Range of TG | 130 - 215 ℃ | 
| Impedance Tolerance | ± 10%, Min: ± 5% | 
| Hi-Pot Test | Max: 4000V/10MA/60S | 
| Surface Treatment | HASL, With Lead, HASL Free Lead | 
| Flash Gold, Immersion Gold | |
| Immersion Silver, Immersion Tin | |
| Gold Finger, OSP | |
| PCB Cu Thickness + Plating | |
| Out Layer Cu Thickness | 1 - 6OZ | 
| Inner Layer Cu Thickness | 0.5 - 4OZ | 
| Cu Thickness of PTH | 20UM ≤ Average ≤ 25UM | 
| Min: 18UM | |
| HASL with Lead | Tin 63% Lead 37% | 
| HASL Free Lead | 7UM ≤ Surface Thickness ≤ 12UM | 
| Thick Gold Plating | Ni Thickness: 3 - 5UM ( 120u" - 200u" ) | 
| Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) | |
| Immersion Gold | Ni Thckness: 3 - 5UM ( 120u" - 200u" ) | 
| Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) | |
| Immersion Silver | Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) | 
| Gold Finger | Ni Thickness: 3 - 5UM ( 120u" - 160u" ) | 
| Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) | |
| U940 PCB Pattern Limit Capability | |
| Min Width | 0.075MM ( 3 mil ) | 
| Min Trace | 0.075MM ( 3 mil ) | 
| Min Width of Ring ( Inner Layer ) | 0.15MM ( 6 mil ) | 
| Min Width of Ring ( Out Layer ) | 0.1MM ( 4 mil ) | 
| Min Solder Bridge | 0.1MM ( 4 mil ) | 
| Min Height of Legend | 0.7MM ( 28 mil ) | 
| Min Width of Legend | 0.15MM ( 6 mil ) | 
| PCB Holes Processing Capability | |
| Final Hole Size | Min: Laser 0.1MM, Machine 0.2MM | 
| Drilling Hole Size | 0.10 - 6.5MM | 
| Drilling Tolerance | NPTH: ±0.05MM, PTH: ±0.075MM | 
| Final Hole Size Tolerance ( PTH ) | φ0.20 - 1.60MM ± 0.075MM | 
| φ1.60 - 6.30MM ± 0.10MM | |
| Final Hole Size Tolerance ( NPTH ) | φ0.20 - 1.60MM ± 0.05MM | 
| φ1.60 - 6.50MM ± 0.05MM | |
| Drilling Strip Hole | -0L ~tu.'gth /width 2:1 | 
| Min Strip Hole Width 0.65MM | |
| Length & Width Tolerance ± 0.05MM | |
| Board Thickness / Hole Size | ≤ 10:1 | 
| PCB Cover Thickness Capability | |
| Solder Mask Color | Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White | 
| Solder Mask Thickness | Surface Line ≥ 10UM | 
| Surface Line Corner ≥ 6UM | |
| Surface Board 10 - 25UM | |
| Solder Mask Bridge Width | |
| Legend Color | White,Yellow,Black | 
| Min Height of Legend | 0.70MM ( 28 mil ) | 
| Min Width of Legend | 0.15MM ( 6 mil ) | 
| Blue Gel Thickness | 0.2 - 1.5MM | 
| Blue Gel Tolerance | ±0.15MM | 
| Carbon Print Thickness | 5 - 25UM | 
| Carbon Print Min Space | 0.25MM | 
| Carbon Print Impedance | 200Ω | 
| Blind/Burried/Half Via PCB Capability | |
| Parameters | (1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8 | 
| Min Via | Laser 0.1MM, Machine 0.2MM | 
| Half Via | Min: 0.6MM | 
| Impedance Capability | |
| Resistance Value | Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω | 
PCB Photos


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