Categories | Hermetic Packages Electronics |
---|---|
Brand Name: | JBNR |
Model Number: | 50MoCu,60MoCu,70MoCu,85MoCu |
Place of Origin: | CHINA |
MOQ: | Negotiation |
Price: | Negotiable |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 25days |
Packaging Details: | as customer required |
Material: | Molybdenum copper |
Density: | 9.8 |
CTE: | 7 |
TC: | 190-200 |
Mo70Cu Heatspreader Materials For Automobile And Industrial Machinery
Description:
Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Advantages:
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
Product Properties:
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
Product picture:
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