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High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: Molybdenum copper
Density: 9.5
CTE: 11.5
TC: 230-270
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    High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages


    High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages


    Description:


    Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


    Advantages:


    High thermal conductivity since no sintering additives have been used

    Excellent hermeticity

    Relatively small density

    Stampable sheets available (Mo content no more than 75 wt%)

    Semi-finished or finished (Ni/Au plated) parts available


    Product Properties:


    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:


    This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


    Product picture:


    Quality High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages for sale
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