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High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 25days
Packaging Details: as customer required
Material: Molybdenum copper
Density: 9.9
CTE: 7
TC: 170-190
Plating: Silver
name: electronic packaging materials
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    High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials


    High-tech MoCu Electronic Packaging Materials With Silver Plating


    Description:

    The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good high-temperature performance and etc. Compared with traditional packaging materials, they have a high thermal conductivity and their CTEs can be tailored by adjusting the Mo/Cu ratio to closely match those of die materials.

    Compared with WCu materials which also enjoy high thermal conductivity and are CTE changeable, MoCu materials have a lower density.


    Advantages:

    1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper composites to be used extensively in microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


    Product picture:

    Quality High Tech MoCu Hermetic Packages Electronics , Electronic Packaging Materials for sale
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