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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50WCu,75WCu,80WCu,85WCu,90WCu
Certification: ISO9001
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: tungsten copper
Density: 16.4
CTE: 7.2
TC: 180-190
Plating: gold
Application: High power device
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    Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink


    Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink

    Description:

    CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram).

    Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.


    Advantages:

    High thermal conductivity

    Excellent hermeticity

    Excellent flatness, surface finish, and size control

    Semi-finished or finished (Ni/Au plated) products available


    Product Properties:


    GradeWt%(W)Wt%(Cu)Density
    at 20ºC
    Thermal conductivity at 25ºCCoefficient of thermal expansion at 20ºC
    W90Cu1090±1rest17.0g/cm3180-1906.5
    W85Cu1585±1rest16.4g/cm3190-2007.0
    W80Cu2080±1rest15.6g/cm3200-2108.3
    W75Cu2575±1rest14.9g/cm3220-2309.0
    W50Cu5050±1rest12.2g/cm3310-34012.5



    Application:

    Applies to high-power device package of materials, such as substrates; high-performance lead frame; military and civilian thermal control devices such as thermal control panels and radiators.


    Product picture:

    Quality Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink for sale
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