eMMC/eMCP Reballing Tool 4 in 1 BGA Rework Station eMMC153 eMMC169
eMCP162 eMCP186 Reball Jig
Do not heat the stencil,this one is not for heating reball,it is an
easy way to reball without heat!!!!
Usage video,this is high-end product usage video,but the usage same
Usage: 1) put the tin solder paste through the stencil 1 T=0.12
2) remove the stencil 1 T=0.12 3) pour balls through stencil 2
T=0.15 4) remove the stencil 2 T=0.15 5) Weld the chip into your
1. Use glass fiber for material , avoiding wrist fatigue for long
2. Moldcore uses high accuracy CNC machining , accurate IC location
3. 4 in 1 design in the Steel mesh , capable apply to eMMC153/169 ,
eMCP162/186 IC reballing at the same time .
4. Moldcore designs with dismountable , easy to change through two
screws , change the moldcore can meantime support different size
eMMC153/eMCP169 IC reballing .
5. High quality and durable
6. Tested before shipping
7. Easy to use
We\'re the original manufaturer , we can provide the lowest and
competitive price , the shortest processing time is guaranteed ! !
! If you have any inquiry , please contact us freely .