Nickel Plated Gold Plated Good Lamination Cu/Mo70Cu/Cu Carriers In
High Power Devices
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a
Mo-Cu alloy core layer and two copper clad layers.The ratio of the
thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal
conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so
comparable speaking, it has higher price-quality ratio.
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip
carriers for microwave, flanges and frames for RF, laser diode
packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232,
CPC111, CPC300 and other contents, you can contact us free.
We also offer tungsten copper heat sink (WCu), molybdenum copper
(MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum
copper copper (Cu/MoCu/Cu) sheets or fabricated parts for
microelectronics packaging and power devices.