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1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board

Categories Copper Shielding Foil
Brand Name: Civen
Model Number: MGP-HR0718006
Certification: CTI
Place of Origin: CHINA
MOQ: 100kg
Price: negotiation according to the sizes
Payment Terms: T/T
Supply Ability: 560M/T per month
Delivery Time: 16working days after received your deposit
Packaging Details: Packed in strong wooden case suit for exporting
Purity: ≥99.8%
Alloy Number: C11000(T2)
Thickness: 1oz/0.035mm
Area Weght: Customized
Application: FPC
Width Range: 550~1295mm(21.65~51inch)
Surface: One side shiny and one side matte
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    1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board


    1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board


    1.Description

    CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).


    2.Specifications:

    Thickness:1OZ(0.035MM)

    Width:150~1290mm


    3.Performance:

    ClassificationUnit

    1/4OZ

    (9μm)

    1/3OZ

    (12μm)

    J OZ

    (15μm)

    1/2OZ

    (18μm)

    1OZ

    (35μm)

    2OZ

    (70μm)

    Cu Content%≥99.8
    Area Weigthg/m280±3107±3127±4153±5283±5585±10
    Tensile StrengthR.T.(25℃)Kg/mm2≥28≥30
    H.T.(180℃)≥15
    ElongationR.T.(25℃)%≥4.0≥5.0≥6.0≥10
    H.T.(180℃)≥4.0≥5.0≥6.0
    RoughnessShiny(Ra)μm≤0.4
    Matte(Rz)≤5.0≤6.0≤7.0≤7.0≤9.0≤14
    Peel StrengthR.T.(23℃)Kg/cm≥1.0≥1.2≥1.2≥1.3≥1.8≥2.0
    Degraded rate of HCΦ(18%-1hr/25℃)%≤5.0
    Change of color(E-1.0hr/190℃)%Good
    Solder Floating 290℃Sec.≥20
    PinholeEAZero
    Preperg----FR-4

    Quality 1oz Single Shiny S - HTE ED copper foil for pcb Printed Circuit Board for sale
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